In order to realize the rapid manufacturing of the integrated components of the structure and circuit, this paper proposes the combination of the additive manufacturing and the integrated structure and circuit technology. Traditional integrated structure and circuit process is based on injection molding , which has high cost and long cycle, so it is difficult to realize rapid manufacturing and iterative design. In this paper, based on selective laser sintering (SLS),the fabrication process of integrated structure and circuit is explored. SLS has the characteristics of fast forming speed and high precision. SLS is used to realize forming, then laser activation and electroless plating are carried out. The experimental results show that the copper plating area with excellent electrical conductivity can be rapidly fabricated on the formed part surface.