2025年4月7日 8:48 星期一
首页 > 过刊浏览>2018年第50卷第4期 >494-500. DOI:10.16356/j.1005-2615.2018.04.010
PDF HTML阅读 XML下载 导出引用 引用提醒
倾斜结构热电元件的多物理场耦合研究
CSTR:
[cstr]
作者:
基金项目:

南京"321"计划重点（2013B03004）资助项目。


Multiphysics Coupling on Thermoelectric Element with Sloping Structure
Author:
  • 摘要
    • | |
  • 访问统计
    • |
  • 参考文献 [15]
    • |
  • 相似文献 [20]
    • | | |
  • 文章评论
    摘要:

    为了提高热电元件的工作性能，在材料用量不变的前提下，提出了新型倾斜结构的热电元件。以常规的垂直型热电元件为参考，采用数值模拟的方法，通过控制热端温度、电流和冷热端温差等参量，对倾斜结构热电元件进行了多物理场耦合研究，重点讨论了倾斜角度对元件制冷性能的影响。结果表明：倾斜角度越大，热电元件冷端温度越低；在小功率条件下，制冷量和制冷系数随倾斜角度的增大而增大；最佳倾角范围是15°~30°；倾斜结构存在场强突变现象；倾斜结构更适用于微小型低功耗热电制冷设备。

    Abstract:

    New type of thermoelectric element with sloping structure is proposed to improve the working performance of thermoelectric element in the condition of same material consumption. Taking the conventional vertical thermoelectric element as a reference, multiphysics coupling is carried on the thermoelectric element with sloping structure by means of numerical simulation and controlling the parameters like hot side temperature, current and temperature difference between cold side and hot side. The influence of slope angle on the cooling performance of thermoelectric element is discussed stressfully. The results show that the larger the slope angle is, the lower the cold side temperature of thermoelectric element is. In the condition of small power, the cooling capacity and coefficient of performance (COP) increase with the increase of the slope angle. The best range of slope angle is 15°-30°. Electric field intensity changes suddenly in sloping structure. Sloping structure is more suitable for the thermoelectric equipment with small size and power.

    参考文献
    [1] 王小群,杜善义.热电制冷技术在航空航天领域的应用[J].中国航天, 2006(10):22-24. WANG Xiaoqun,DU Shanyi.Thermoelectric cooling technology applied in aerospace field[J].Aerospace China,2006(10):22-24.
    [2] HEALTHCARE G.2-D electrophoresis:Principles and methods[M]. USA:GE Healthcare Limited,2007.
    [3] 祝薇,邓元,王瑶,等.热电薄膜材料的制备和制冷器件的数值模拟[J].北京航空航天大学学报, 2015,41(8):1435-1442. ZHU Wei,DENG Yuan,WANG Yao,et al.Preparation of thermoelectric thin film material and numerical simulation of cooler[J].Journal of Beijing University of Aeronautics and Astronautics,2015,41(8):1435-1442.
    [4] MCCARTY R. A comparison between numerical and simplified thermoelectric cooler models[J]. Journal of Electronic Materials,2010, 39(9):1842-1847.
    [5] 申利梅,陈焕新,梅佩佩,等.热电制冷模块热连接与电连接的性能优化分析[J].化工学报,2012,63(5):1367-1372. SHEN Limei,CHEN Huanxin,MEI Peipei,et al. Optimization analysis on thermal connection and electrical connection of thermoelectric refrigeration modules[J].CIESC Journal,2012,63(5):1367-1372.
    [6] 杨凡超,王洪伟,王彩玲,等.第二类边界条件下热电偶非均匀内热源的工程求解分析[J].红外与激光工程,2013,42(S1):30-33. YANG Fanchao,WANG Hongwei,WANG Cailing,et al. Engineering analysis of non-uniform internal heat source in the thermocouple under the second boundary condition[J].Infrared and Laser Engineering,2013,42(S1):30-33.
    [7] CHANG N K,KIM J.Numerical examination of the performance of a thermoelectric cooler with peltier heating and cooling[J]. Journal of Electronic Materials,2015,44(10):1-6.
    [8] CAI Y,LIU D,ZHAO F Y,et al.Performance analysis and assessment of thermoelectric micro cooler for electronic devices[J].Energy Conversion & Management,2016,124:203-211.
    [9] 胡仁喜,闫波.ANSYS 15.0多物理耦合场有限元分析从入门到精通[M].3版.北京:机械工业出版社, 2015. HU Renxi, Yan Bo. ANSYS 15.0 finite element analysis of multiphysics coupling field from entry to mastery[M]. 3rd ed. Beijing:China Machine Press, 2015.
    [10] 徐德胜.半导体制冷与应用技术[M].2版.上海:上海交通大学出版社,1999. XU Desheng.Technology of semiconductor refrigeration and application[M].2nd ed.Shanghai:Shanghai Jiao Tong University Press, 1999.
    [11] CHEN J,YU J,MA M.Theoretical study on an integrated two-stage cascaded thermoelectric module operating with dual power sources[J]. Energy Conversion & Management,2015,98:28-33.
    [12] 申利梅,陈焕新,张威,等.影响热电制冷性能的关键因素及其分析[J].红外与激光工程,2011, 40(10):1866-1872. SHEN Limei,CHEN Huanxin,ZHANG Wei,et al.Analysis of the crucial factors affecting the performance of thermoelectric cooling[J]. Infrared and Laser Engineering, 2011, 40(10):1866-1872.
    [13] WANG X D,HUANG Y X,CHENG C H,et al.A three-dimensional numerical modeling of thermoelectric device with consideration of coupling of temperature field and electric potential field[J]. Energy, 2012,47(1):488-497.
    [14] CHEN W H,LIAO C Y,HUNG C I. A numerical study on the performance of miniature thermoelectric cooler affected by Thomson effect[J]. Applied Energy, 2012, 89(1):464-473.
    [15] 许京荆.ANSYS 13.0 Workbench数值模拟技术[M].北京:中国水利水电出版社,2012. XU Jingjing.ANSYS 13.0 workbench numerical simulation technology[M]. Beijing:China Water & Power Press.2012.
    引证文献
    网友评论
    网友评论
    分享到微博
    发 布
引用本文

许鹏飞, 唐豪.倾斜结构热电元件的多物理场耦合研究[J].南京航空航天大学学报,2018,50(4):494-500

复制
分享
文章指标
  • 点击次数:1362
  • 下载次数: 2122
  • HTML阅读次数: 1128
  • 引用次数: 0
历史
  • 收稿日期:2017-08-17
  • 最后修改日期:2018-01-26
  • 在线发布日期: 2018-09-08
文章二维码
您是第6587748位访问者
网站版权 © 南京航空航天大学学报
技术支持：北京勤云科技发展有限公司
请使用 Firefox、Chrome、IE10、IE11、360极速模式、搜狗极速模式、QQ极速模式等浏览器，其他浏览器不建议使用!