To reduce the curing temperature of heat-resistant low-infrared-emissivity coatings， the curing agent and the CeO2 packing with different grain sizes are added into the coatings to adjust the chemical cross-linking and physical water loss of the curing coatings， respectively. The effect of curing agent and CeO2 size on the cross-linking degree and thermal shock performance of coatings is investigated. Three-dimensional network structure of the silicate binder is characterized by transmission electron microscopy (TEM). The pore distribution of the coatings is observed by scanning electron microscope (SEM). And then， the infrared emissivity of the coating is measured by IR-2. The results show that， coatings can not only cure at low temperature (35 ℃) and maintain the good thermal shock performance (40 times)， but also keep low infrared emissivity with the lowest one of 0.376.