Pulse l aser is introduced in the localized electrochemical deposition system， and thre e dimensional copper microstructures are constructed by a compound processing of laser irradiation and localized electrochemical deposition deposition. The therm al effect a nd plasma effects of the laser on localized electrochemical deposition are analy zed. The experimental system of laser assisted localized electrochemical deposi tion is e stablished， and experiments are carried out. The scanning electron microscope (S EM) a nd energy dispersive X ray spectroscopy are utilized to detect the electroplate d structures. The results show that compared with the electroplated features gro wn wi thout laser irradiation， the electroplating speed of features grown with laser i rradiation is faster and the localization is better. With the increase of the la ser energy， the depositing aspect ratio increases. Meanwhile， with laser irradia tion， the impurities of cathode are reduced.