The thermal stress distribution of adhesive layer in bonded structures is studied by establishing a finite element model (FEM). Through the environmental test of the adhesive layer, the difference between the strain at the middle point and the end point of the adhesive layer and the simulation results is compared, and the reliability of the finite element simulation results is verified. The influence of several factors，such as the thickness of the adhesive layer, the difference of the coefficient of thermal expansion (CTE) of the bonded materials on both sides of the adhesive layer and the change of stiffness of the bonded materials, on the thermal stress distribution of the adhesive layer is studied. Finally, for the adhesive structure that needs to be used in the environment with large temperature span, the thickness of the adhesive layer and the type of bonding materials should be selected by considering the thermal stress damage of the adhesive layer.