The paper gives a review on the development and application of bonding techniques in micro/nano electromechanical system(MEMS/NEMS) industry, and summarizes the importance and the main characteristics of anodic bonding as one of vital important bonding techniques. The paper also points out the mechanical problems involved in anodic bonding, such as surface contact adhesion under bonding force (electrostatic force, surface force, etc.), particle diffusion or reaction at contact interface under electrical field, residual stress in the bonding interface, and so on. Mechanical behavior and properties of anodic bonding interface layer are directly related to the safety and reliability of micromechanical structures in MEMS devices. The studies of these problems are helpful to better understand the mechanical behavior of anodic bonding, and also give more informative data for the design, fabrication and practical application of MEMS/NEMS devices.